01 · 损益表
10-K 年报仅提供 GAAP 数据 ·
年度指标
| 指标 |
FY2024 |
FY2023 |
Y/Y |
FY2022 |
| 营收 Revenue |
$9,812M |
$10,496M |
-7% |
$9,212M |
| 毛利率 Gross Margin |
60.0% |
59.8% |
+0.2 ppt |
61.0% |
| 研发费用 R&D |
$1,279M |
$1,297M |
-1% |
$1,105M |
| 销售及管理 SG&A |
$970M |
$986M |
-2% |
$860M |
| 折旧摊销 D&A |
$402M |
$415M |
-3% |
$363M |
| 股权激励 SBC |
$213M |
$171M |
+24% |
$127M |
| 营业利润 Operating Income |
$3,346M |
$3,995M |
-16% |
$3,654M |
| 利息费用 Interest Expense |
$311M |
$297M |
+5% |
$160M |
| 净利润 Net Income |
$2,762M |
$3,387M |
-18% |
$3,322M |
补充指标
| 指标 |
FY2024 |
FY2023 |
Y/Y |
FY2022 |
| 每股收益 EPS |
$20.28 |
$24.15 |
-16% |
$21.92 |
| 稀释股数 Diluted Shares |
136M |
140M |
-3% |
152M |
| 实际税率 Effective Tax Rate |
13.4% |
10.6% |
+2.8 ppt |
4.8% |
product
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| Wafer Inspection |
$4,333M |
44.2% |
— |
-0% |
| Patterning |
$2,054M |
20.9% |
— |
-26% |
| Services |
$2,330M |
23.7% |
— |
+10% |
| Specialty Semiconductor Process |
$471M |
4.8% |
— |
-4% |
| PCB and Component Inspection |
$291M |
3.0% |
— |
-23% |
| Other |
$333M |
3.4% |
— |
-13% |
geography
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| China |
$4,197M |
42.8% |
— |
+46% |
| Taiwan |
$1,738M |
17.7% |
— |
-30% |
| North America |
$1,071M |
10.9% |
— |
-15% |
| Japan |
$963M |
9.8% |
— |
+8% |
| Korea |
$907M |
9.2% |
— |
-52% |
| Europe and Israel |
$540M |
5.5% |
— |
-21% |
| Rest of Asia |
$396M |
4.0% |
— |
-4% |
customer
| 项目 |
占比 |
| TSMC |
13.0% |
| Samsung |
NaN% |
FY2024仅TSMC超过10%营收门槛（约13%）。Samsung在FY2024未超过10%。