01 · 损益表
季度指标
| 指标 |
Q4 FY2024 |
Q3 FY2024 |
Q/Q |
Q4 FY2023 |
Y/Y |
| 营收 Revenue |
$7,045M |
$6,778M |
+4% |
$6,723M |
+5% |
| 毛利率 Gross Margin (GAAP) |
47.3% |
47.3% |
+0.0 ppt |
47.1% |
+0.2 ppt |
| 毛利率 Gross Margin (Non-GAAP) |
47.5% |
— |
— |
47.3% |
+0.2 ppt |
| 研发费用 R&D |
$858M |
$836M |
+3% |
$789M |
+9% |
| 销售及管理 SG&A |
$431M |
$427M |
+1% |
$409M |
+5% |
| 折旧摊销 D&A |
$110M |
$95M |
+16% |
$130M |
-15% |
| 股权激励 SBC |
$141M |
$132M |
+7% |
$115M |
+23% |
| 营业利润 Operating Income (GAAP) |
$2,046M |
$1,942M |
+5% |
$1,971M |
+4% |
| 利息费用 Interest Expense |
$66M |
$63M |
+5% |
$58M |
+14% |
| 净利润 Net Income (GAAP) |
$1,731M |
$1,705M |
+2% |
$2,004M |
-14% |
| 净利润 Net Income (Non-GAAP) |
$1,917M |
— |
— |
$1,786M |
+7% |
补充指标
| 指标 |
Q4 FY2024 |
Q3 FY2024 |
Q/Q |
Q4 FY2023 |
Y/Y |
| 每股收益 EPS (GAAP) |
$2.09 |
$2.05 |
+2% |
$2.38 |
-12% |
| 每股收益 EPS (Non-GAAP) |
$2.32 |
— |
— |
$2.12 |
+9% |
| 稀释股数 Diluted Shares |
828M |
833M |
-1% |
842M |
-2% |
| 实际税率 Effective Tax Rate |
8.7% |
13.0% |
-4.3 ppt |
7.7% |
+1.0 ppt |
product
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| Semiconductor Systems |
$5,177M |
73.5% |
+5% |
+6% |
| Applied Global Services |
$1,639M |
23.3% |
+4% |
+11% |
| Display |
$211M |
3.0% |
— |
-29% |
| Corporate and Other |
$18M |
0.3% |
-22% |
-75% |
end_market
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| Foundry, Logic and Other |
$3,779M |
53.6% |
— |
+12% |
| DRAM |
$1,191M |
16.9% |
— |
-10% |
| Flash Memory |
$207M |
2.9% |
— |
+6% |
半导体系统部门内部按终端市场拆分（基于披露百分比 73%/23%/4% 乘以部门营收 $5,177M 计算）
geography
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| China |
$2,136M |
30.3% |
-1% |
-28% |
| Taiwan |
$1,284M |
18.2% |
+12% |
+39% |
| Korea |
$1,172M |
16.6% |
+6% |
+57% |
| United States |
$1,153M |
16.4% |
+9% |
+44% |
| Japan |
$581M |
8.2% |
+5% |
-15% |
| Europe |
$405M |
5.7% |
+19% |
-8% |
| Southeast Asia |
$314M |
4.5% |
-27% |
+87% |