01 · 损益表
季度指标
| 指标 |
Q3 FY2024 |
Q2 FY2024 |
Q/Q |
Q3 FY2023 |
Y/Y |
| 营收 Revenue |
$6,778M |
$6,646M |
+2% |
$6,425M |
+5% |
| 毛利率 Gross Margin (GAAP) |
47.3% |
47.4% |
-0.1 ppt |
46.3% |
+1.0 ppt |
| 毛利率 Gross Margin (Non-GAAP) |
47.4% |
— |
— |
— |
— |
| 研发费用 R&D |
$836M |
$785M |
+6% |
$767M |
+9% |
| 销售及管理 SG&A |
$427M |
$456M |
-6% |
$407M |
+5% |
| 折旧摊销 D&A |
$95M |
$96M |
-1% |
$136M |
-30% |
| 股权激励 SBC |
$132M |
$134M |
-1% |
$114M |
+16% |
| 营业利润 Operating Income (GAAP) |
$1,942M |
$1,912M |
+2% |
$1,802M |
+8% |
| 利息费用 Interest Expense |
$63M |
$59M |
+7% |
$60M |
+5% |
| 净利润 Net Income (GAAP) |
$1,705M |
$1,722M |
-1% |
$1,560M |
+9% |
| 净利润 Net Income (Non-GAAP) |
$1,767M |
— |
— |
— |
— |
补充指标
| 指标 |
Q3 FY2024 |
Q2 FY2024 |
Q/Q |
Q3 FY2023 |
Y/Y |
| 每股收益 EPS (GAAP) |
$2.05 |
$2.06 |
-0% |
$1.85 |
+11% |
| 每股收益 EPS (Non-GAAP) |
$2.12 |
— |
— |
— |
— |
| 稀释股数 Diluted Shares |
833M |
836M |
-0% |
843M |
-1% |
| 实际税率 Effective Tax Rate |
13.0% |
13.6% |
-0.6 ppt |
13.6% |
-0.6 ppt |
product
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| Semiconductor Systems |
$4,924M |
72.6% |
+0% |
+5% |
| Applied Global Services |
$1,580M |
23.3% |
+3% |
+8% |
| Display and Adjacent Markets |
$251M |
3.7% |
+40% |
+7% |
| Corporate and Other |
$23M |
0.3% |
-36% |
-54% |
end_market
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| Foundry, Logic and Other |
$3,545M |
52.3% |
— |
— |
| DRAM |
$1,182M |
17.4% |
— |
— |
| Flash Memory |
$197M |
2.9% |
— |
— |
半导体系统部门内部按终端市场拆分（基于披露百分比 72%/24%/4% 乘以部门营收 $4,924M 计算）
geography
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| China |
$2,153M |
31.8% |
-24% |
+24% |
| Taiwan |
$1,148M |
16.9% |
+13% |
-15% |
| Korea |
$1,102M |
16.3% |
+12% |
+12% |
| United States |
$1,053M |
15.5% |
+23% |
+1% |
| Japan |
$555M |
8.2% |
+23% |
+16% |
| Southeast Asia |
$428M |
6.3% |
+101% |
+138% |
| Europe |
$339M |
5.0% |
+17% |
-49% |