01 · 损益表
季度指标
| 指标 |
Q2 FY2025 |
Q1 FY2025 |
Q/Q |
Q2 FY2024 |
Y/Y |
| 营收 Revenue |
$7,100M |
$7,166M |
-1% |
$6,646M |
+7% |
| 毛利率 Gross Margin (GAAP) |
49.1% |
48.8% |
+0.3 ppt |
47.4% |
+1.7 ppt |
| 毛利率 Gross Margin (Non-GAAP) |
49.2% |
— |
— |
— |
— |
| 研发费用 R&D |
$893M |
$859M |
+4% |
$785M |
+14% |
| 销售及管理 SG&A |
$423M |
$462M |
-8% |
$456M |
-7% |
| 折旧摊销 D&A |
$103M |
$105M |
-2% |
$96M |
+7% |
| 股权激励 SBC |
$159M |
$195M |
-18% |
$134M |
+19% |
| 营业利润 Operating Income (GAAP) |
$2,169M |
$2,175M |
-0% |
$1,912M |
+13% |
| 利息费用 Interest Expense |
$68M |
$64M |
+6% |
$59M |
+15% |
| 净利润 Net Income (GAAP) |
$2,137M |
$1,185M |
+80% |
$1,722M |
+24% |
| 净利润 Net Income (Non-GAAP) |
$1,940M |
— |
— |
— |
— |
补充指标
| 指标 |
Q2 FY2025 |
Q1 FY2025 |
Q/Q |
Q2 FY2024 |
Y/Y |
| 每股收益 EPS (GAAP) |
$2.63 |
$1.45 |
+81% |
$2.06 |
+28% |
| 每股收益 EPS (Non-GAAP) |
$2.39 |
— |
— |
— |
— |
| 稀释股数 Diluted Shares |
812M |
819M |
-1% |
836M |
-3% |
| 实际税率 Effective Tax Rate |
8.0% |
44.1% |
-36.1 ppt |
13.6% |
-5.6 ppt |
product
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| Semiconductor Systems |
$5,255M |
74.0% |
-2% |
+7% |
| Applied Global Services |
$1,566M |
22.1% |
-2% |
+2% |
| Display |
$259M |
3.6% |
+42% |
— |
| Corporate and Other |
$20M |
0.3% |
-39% |
-44% |
end_market
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| Foundry, Logic and Other |
$3,416M |
48.1% |
— |
— |
| DRAM |
$1,419M |
20.0% |
— |
— |
| Flash Memory |
$420M |
5.9% |
— |
— |
半导体系统部门内部按终端市场拆分（基于披露百分比 65%/27%/8% 乘以部门营收 $5,255M 计算）
geography
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| China |
$1,774M |
25.0% |
-21% |
-37% |
| Taiwan |
$1,997M |
28.1% |
+69% |
+96% |
| Korea |
$1,562M |
22.0% |
-6% |
+58% |
| United States |
$808M |
11.4% |
-12% |
-5% |
| Japan |
$572M |
8.1% |
+6% |
+26% |
| Europe |
$252M |
3.5% |
-24% |
-13% |
| Southeast Asia |
$135M |
1.9% |
-53% |
-37% |