01 · 损益表
季度指标
| 指标 |
Q1 FY2025 |
Q4 FY2024 |
Q/Q |
Q1 FY2024 |
Y/Y |
| 营收 Revenue |
$7,166M |
$7,045M |
+2% |
$6,707M |
+7% |
| 毛利率 Gross Margin (GAAP) |
48.8% |
47.3% |
+1.5 ppt |
47.8% |
+1.0 ppt |
| 毛利率 Gross Margin (Non-GAAP) |
48.9% |
47.5% |
+1.4 ppt |
— |
— |
| 研发费用 R&D |
$859M |
$858M |
+0% |
$754M |
+14% |
| 销售及管理 SG&A |
$462M |
$431M |
+7% |
$483M |
-4% |
| 折旧摊销 D&A |
$105M |
$110M |
-5% |
$91M |
+15% |
| 股权激励 SBC |
$195M |
$141M |
+38% |
$170M |
+15% |
| 营业利润 Operating Income (GAAP) |
$2,175M |
$2,046M |
+6% |
$1,967M |
+11% |
| 利息费用 Interest Expense |
$64M |
$66M |
-3% |
$59M |
+8% |
| 净利润 Net Income (GAAP) |
$1,185M |
$1,731M |
-32% |
$2,019M |
-41% |
| 净利润 Net Income (Non-GAAP) |
$1,946M |
$1,917M |
+2% |
— |
— |
补充指标
| 指标 |
Q1 FY2025 |
Q4 FY2024 |
Q/Q |
Q1 FY2024 |
Y/Y |
| 每股收益 EPS (GAAP) |
$1.45 |
$2.09 |
-31% |
$2.41 |
-40% |
| 每股收益 EPS (Non-GAAP) |
$2.38 |
$2.32 |
+3% |
— |
— |
| 稀释股数 Diluted Shares |
819M |
828M |
-1% |
837M |
-2% |
| 实际税率 Effective Tax Rate |
44.1% |
8.7% |
+35.4 ppt |
12.3% |
+31.8 ppt |
product
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| Semiconductor Systems |
$5,356M |
74.7% |
+3% |
+9% |
| Applied Global Services |
$1,594M |
22.2% |
-3% |
+8% |
| Display |
$183M |
2.6% |
-13% |
-25% |
| Corporate and Other |
$33M |
0.5% |
+83% |
-58% |
end_market
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| Foundry, Logic and Other |
$3,642M |
50.8% |
-4% |
— |
| DRAM |
$1,500M |
20.9% |
+26% |
— |
| Flash Memory |
$214M |
3.0% |
+3% |
— |
半导体系统部门内部按终端市场拆分（基于披露百分比 68%/28%/4% 乘以部门营收 $5,356M 计算）
geography
| 板块 |
收入 |
占比 |
QoQ |
YoY |
| China |
$2,243M |
31.3% |
+5% |
-25% |
| Korea |
$1,667M |
23.3% |
+42% |
+35% |
| Taiwan |
$1,183M |
16.5% |
-8% |
+112% |
| United States |
$917M |
12.8% |
-20% |
+21% |
| Japan |
$540M |
7.5% |
-7% |
-4% |
| Europe |
$330M |
4.6% |
-19% |
-20% |
| Southeast Asia |
$286M |
4.0% |
-9% |
+54% |